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Wafer Level Solid Liquid Interdiffusion Bonding Formation and Evolution of Microstructures

Year of publication

2021

Authors

Vuorinen, V.; Dong, H.; Ross, G.; Hotchkiss, J.; Kaaos, J.; Paulasto-Kröckel, M.

Organizations and authors

Aalto University

Ross Glenn Orcid -palvelun logo

Dong Hongqun Orcid -palvelun logo

Vuorinen Vesa Orcid -palvelun logo

Kaaos Jani

Hotchkiss Joseph

Paulasto-Kröckel Mervi

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal

JOURNAL OF ELECTRONIC MATERIALS

Publisher

SPRINGER

Volume

50

Issue

3

Pages

818-824

ISSN

0361-5235

​Publication forum

60241

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

Self-archived

Yes

Other information

Fields of science

Electronic, automation and communications engineering, electronics

Keywords

[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

DOI

10.1007/s11664-020-08530-y

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes