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In-line Vector Modulator Integration in Dielectric-filled Waveguide

Year of publication

2023

Authors

Haarla, Jaakko; Ala-Laurinaho, Juha; Lahti, Markku; Varonen, Mikko; Kantanen, Mikko; Holmberg, Jan; Viikari, Ville

Abstract

<p>This paper proposes a scalable substrate-integrated waveguide (SIW) module accommodating an in-line vector modulator monolithic millimeter integrated circuit (MMIC). The SIW module is realized with low-temperature co-fired ceramic (LTCC) technology, and it can be inserted in a dielectric-filled waveguide (DFWG). The module combines &amp;#x03BB;<sub>&lt;italic&gt;g&lt;/italic&gt;</sub>/4-transformer-based E-plane tapering and SIWs on LTCC with the wire-bonded vector modulator. The proposed active LTCC module and two passive test structures (i.e., a constant-height-SIW module and a SIW module with E-plane taperings) are manufactured and tested as in-line modules in a DFWG. The passive test structures with the waveguide-to-DFWG and DFWG-to-SIW transitions measure 3.1 dB and 4.6 dB of insertion loss on average, respectively, at the 71&amp;#x2013;81 GHz frequency range. The active LTCC module measurements demonstrate a dielectric-filled waveguide with phase and amplitude tuning capability and gain up to 17.6 dB within the same frequency range. A four-channel mock-up module with &amp;#x03BB;<sub>0</sub>/2 channel spacing is designed and manufactured to demonstrate the scalability of the design.</p>
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Organizations and authors

Aalto University

Haarla Jaakko

Ala-Laurinaho Juha Orcid -palvelun logo

Viikari Ville Orcid -palvelun logo

VTT Technical Research Centre of Finland Ltd

Haarla Jaakko

Holmberg Jan

Lahti Markku Orcid -palvelun logo

Kantanen Mikko Orcid -palvelun logo

Varonen Mikko Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Publisher

IEEE

Volume

13

Issue

2

Pages

153-160

​Publication forum

70578

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

Self-archived

Yes

Other information

Fields of science

Electronic, automation and communications engineering, electronics; Materials engineering

Identified topic

[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

DOI

10.1109/TCPMT.2023.3244865

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes