In-line Vector Modulator Integration in Dielectric-filled Waveguide
Year of publication
2023
Authors
Haarla, Jaakko; Ala-Laurinaho, Juha; Lahti, Markku; Varonen, Mikko; Kantanen, Mikko; Holmberg, Jan; Viikari, Ville
Abstract
<p>This paper proposes a scalable substrate-integrated waveguide (SIW) module accommodating an in-line vector modulator monolithic millimeter integrated circuit (MMIC). The SIW module is realized with low-temperature co-fired ceramic (LTCC) technology, and it can be inserted in a dielectric-filled waveguide (DFWG). The module combines &#x03BB;<sub><italic>g</italic></sub>/4-transformer-based E-plane tapering and SIWs on LTCC with the wire-bonded vector modulator. The proposed active LTCC module and two passive test structures (i.e., a constant-height-SIW module and a SIW module with E-plane taperings) are manufactured and tested as in-line modules in a DFWG. The passive test structures with the waveguide-to-DFWG and DFWG-to-SIW transitions measure 3.1 dB and 4.6 dB of insertion loss on average, respectively, at the 71&#x2013;81 GHz frequency range. The active LTCC module measurements demonstrate a dielectric-filled waveguide with phase and amplitude tuning capability and gain up to 17.6 dB within the same frequency range. A four-channel mock-up module with &#x03BB;<sub>0</sub>/2 channel spacing is designed and manufactured to demonstrate the scalability of the design.</p>
Show moreOrganizations and authors
Publication type
Publication format
Article
Parent publication type
Journal
Article type
Original article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A1 Journal article (refereed), original researchPublication channel information
Publisher
Volume
13
Issue
2
Pages
153-160
ISSN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
Yes
Open access of publication channel
Partially open publication channel
Self-archived
Yes
Other information
Fields of science
Electronic, automation and communications engineering, electronics; Materials engineering
Identified topic
[object Object]
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1109/TCPMT.2023.3244865
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes