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Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders

Year of publication

2005

Authors

Laurila, T.; Vuorinen, V.; Mattila, T.; Kivilahti, J. K.

Organizations and authors

Aalto University

Kivilahti J. K.

Laurila Tomi Orcid -palvelun logo

Mattila Toni

Vuorinen Vesa Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Journal of Electronic Materials

Publisher

SPRINGER

Volume

34

Issue

1

Pages

103-111

ISSN

0361-5235

​Publication forum

60241

​Publication forum level

1

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Keywords

[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

DOI

10.1007/s11664-005-0186-2

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes