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Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Year of publication

2024

Authors

Emadi, Fahimeh; Vuorinen, Vesa; Liu, Shenyi; Paulasto-Krockel, Mervi

Organizations and authors

Aalto University

Emadi Fahimeh Orcid -palvelun logo

Paulasto-Krockel Mervi Orcid -palvelun logo

Liu Shenyi Orcid -palvelun logo

Vuorinen Vesa Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Publisher

IEEE

Volume

14

Issue

8

Pages

1337-1346

ISSN

2156-3950

​Publication forum

70578

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

Self-archived

Yes

Other information

Fields of science

Electronic, automation and communications engineering, electronics

Keywords

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Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

DOI

10.1109/TCPMT.2024.3430061

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes