Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging

Year of publication

2025

Authors

Emadi, Fahimeh; Liu, Shenyi; Vuorinen, Vesa; Paulasto-Krockel, Mervi

Organizations and authors

Aalto University

Emadi Fahimeh

Paulasto-Krockel Mervi

Liu Shenyi

Vuorinen Vesa

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

IEEE Transactions on Components, Packaging and Manufacturing Technology

Publisher

IEEE

Volume

Issue

Pages

377-386

ISSN

2156-3950

Publication forum

70578

Publication forum level

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

Self-archived

Yes

Other information

Fields of science

Electronic, automation and communications engineering, electronics; Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Identified topic

[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

DOI

10.1109/TCPMT.2025.3528519

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes