Electronic components imaged to generate a 3D-model for Finite Element Method modeling, to investigate a related phenomenon from other measurements. Components are IGBT semiconductor modules, EconoPACK and HiPak. Preview dataset found at https://doi.org/10.23729/41fa6cbf-5bb1-4f67-98a9-088bfc034f33 . To obtain data, please contact fairdata-pas@gtk.fi .

2021