Electronic Components preview

Description

Electronic components imaged to generate a 3D-model for Finite Element Method modeling, to investigate a related phenomenon from other measurements. Components are IGBT semiconductor modules, EconoPACK and HiPak. Preview of PAS dataset

Year of publication

2021

Authors

Geological Survey of Finland

Jukka Kuva - Creator, Publisher

LUT University

Aleksi Mattsson - Creator

Other information

Fields of science

Physical sciences

Open access

Open

License

Creative Commons Attribution 4.0 International (CC BY 4.0)

Keywords

tomography, electronics, finite element method, modeling