Printed intelligence is rapidly emerging key enable technology for next generation products such as flexible, thin, light-weight and cost- and resource-efficient electronics. Printed intelligence infrastructure (PII) is established to provide word-class research and development environment to researchers and technology developers. It offers an efficient use and easy access to a modern research and pilot-manufacturing infrastructure covering the whole research/development path from (i) materials via (ii) functional printing, (iii) components and devices to (iv) circuits and systems. Available processes include synthesis on novel materials, formulation of inks, high-density digital fabrication and large-area roll-to-roll (R2R) processes for low-voltage thin-film devices and circuitry including finishing and integration. Application areas are e.g. distributed sensors (IoE), diagnostics, on-skin electronics, and personalized drug dosing, with sustainability as a comprehensive approach.

2024

2028