Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS
Year of publication
2018
Authors
Vuorinen, Vesa; Ross, Glenn; Viljanen, Heikki; Decker, James; Paulasto-Krockel, Mervi
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Parent publication name
Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
Publisher
Article number
8546398
ISBN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
No
Self-archived
Yes
Other information
Fields of science
Electronic, automation and communications engineering, electronics; Mechanical engineering
Keywords
[object Object],[object Object],[object Object],[object Object]
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1109/ESTC.2018.8546398
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes