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Aluminum oxide from trimethylaluminum and water by atomic layer deposition: The temperature dependence of residual stress, elastic modulus, hardness and adhesion

Year of publication

2014

Authors

Ylivaara, Oili M.E.; Liu, Xuwen; Kilpi, Lauri; Lyytinen, Jussi; Schneider, Dieter; Laitinen, Mikko; Julin, Jaakko; Ali, Saima; Sintonen, Sakari; Berdova, Maria; Haimi, Eero; Sajavaara, Timo; Ronkainen, Helena; Lipsanen, Harri; Koskinen, Jari; Hannula, Simo Pekka; Puurunen, Riikka L.
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Organizations and authors

VTT Technical Research Centre of Finland Ltd

Ronkainen Helena Orcid -palvelun logo

Kilpi Lauri

Ylivaara Oili M.E. Orcid -palvelun logo

Puurunen Riikka L.

Aalto University

Haimi Eero

Lipsanen Harri Orcid -palvelun logo

Koskinen Jari

Lyytinen Jussi

Berdova Maria

Ylivaara Oili Orcid -palvelun logo

Puurunen Riikka Orcid -palvelun logo

Ali Saima

Sintonen Sakari

Hannula Simo-Pekka Orcid -palvelun logo

Liu Xuwen

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Thin solid films

Volume

552

Pages

124-135

​Publication forum

68419

​Publication forum level

2

Open access

Open access in the publisher’s service

No

Self-archived

Yes

License of the self-archived publication

CC BY NC ND

Other information

Fields of science

Physical sciences; Chemical sciences; Electronic, automation and communications engineering, electronics; Materials engineering; Nanotechnology; Medical biotechnology

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Yes

Co-publication with a company

No

DOI

10.1016/j.tsf.2013.11.112

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes