Wafer-level SLID bonding for MEMS encapsulation

Year of publication

2013

Authors

Xu, Hongbo; Suni, Tommi; Vuorinen, Vesa; Li, Jue; Heikkinen, Hannele; Monnoyer, Philippe; Paulasto-Kröckel, Mervi

Organizations and authors

VTT Technical Research Centre of Finland Ltd

Heikkinen Hannele

Monnoyer Philippe

Suni Tommi

Aalto University

Paulasto-Kröckel Mervi

Vuorinen Vesa

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Advances in manufacturing

Volume

Issue

Pages

226- 235

ISSN

2095-3127

Publication forum

78108

Publication forum level

Open access

Open access in the publisher’s service

Self-archived

Other information

Fields of science

Electronic, automation and communications engineering, electronics

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

DOI

10.1007/s40436-013-0035-0

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes