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Substrate integrated waveguide E-plane tapering in low-temperature co-fired ceramic

Year of publication

2021

Authors

Haarla, Jaakko; Ala-Laurinaho, Juha; Lahti, Markku; Viikari, Ville

Abstract

This letter discusses the design, manufacture, and characterization of a substrate-integrated waveguide E-plane tapering. The tapering facilitates the integration of two waveguides with varying heights for, that is, conductor-backed coplanar waveguide to rectangular waveguide integration. A simultaneous top- and bottom-sided, λ/4-based stepped tapering for the 71–86 GHz band is designed using low-temperature co-fired ceramic technology. The fabricated design is measured using two E-plane taperings in back-to-back configuration. The reflection coefficient better than −11.8 dB, and the transmission coefficient larger than −1.4 dB at the full 71–86-GHz range for a single tapering is extracted from the measurement using time-gating.
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Organizations and authors

Aalto University

Ala-Laurinaho Juha Orcid -palvelun logo

Viikari Ville Orcid -palvelun logo

Haarla Jaakko

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Volume

63

Issue

4

Pages

1165-1170

​Publication forum

63350

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

Self-archived

Yes

Article processing fee (EUR)

2400

Year of payment for the open publication fee

2020

Other information

Fields of science

Physical sciences; Electronic, automation and communications engineering, electronics; Materials engineering

Keywords

[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

DOI

10.1002/mop.32740

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes