Characterization of PillarHall test chip structures using a reflectometry technique
Year of publication
2023
Authors
Danilenko, Aleksandr; Rastgou, Masoud; Manoocheri, Farshid; Kinnunen, Jussi; Korpelainen, Virpi; Lassila, Antti; Ikonen, Erkki
Abstract
<p>Thin film samples where one of the thin layers consists of a vacuum or air are called PillarHalls due to their support structure in silicon wafers. Custom PillarHall samples were provided by Chipmetrics Ltd and characterized by reflectometry with a Cary 7000 spectrometer. Data at 8° of angle of incidence were collected with p-polarization of the incident light within the wavelength range of 550-1800 nm. These data were then analyzed with a dedicated MATLAB code, using fitting software accompanying the transfer matrix method for calculation of the reflectance spectrum. Layer thicknesses and unknown refractive indices were chosen as fitted parameters. The oscillating reflectance spectrum of the PillarHall test chip yielded an air gap thickness of 86 nm with an estimated standard uncertainty of 5 nm. This is close to the nominal value of 100 nm. The results demonstrate that reflectometry data are sensitive to the thickness of the thin air layer deep inside the silicon structure.</p>
Show moreOrganizations and authors
Publication type
Publication format
Article
Parent publication type
Journal
Article type
Original article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A1 Journal article (refereed), original researchPublication channel information
Journal/Series
Publisher
Volume
34
Issue
9
Article number
094006
ISSN
Publication forum
Publication forum level
2
Open access
Open access in the publisher’s service
Yes
Open access of publication channel
Partially open publication channel
Self-archived
Yes
Other information
Fields of science
Mathematics; Physical sciences
Keywords
[object Object],[object Object],[object Object],[object Object]
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
Yes
DOI
10.1088/1361-6501/acda54
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes