Optimal sensor placement of triaxial accelerometers for modal expansion
Year of publication
2023
Authors
Nieminen, Vesa; Sopanen, Jussi
Abstract
<p>Sensor placement is a vital factor affecting the quality and accuracy of virtual sensing. Modal expansion techniques are well-known methods to expand the measured displacements or accelerations to all unmeasured degrees of freedom. For this purpose, a two-phase sensor placement optimisation method is proposed for commonly used triaxial accelerometers. The method uses minimum variance criterion of an estimation error of structural responses. A measure of redundancy of information is introduced as an additional criterion for the placement of the triaxial sensors to minimise the redundancy between the sensors. This was addressed to avoid spatial correlation and clustering of the sensor locations. In addition, a proposal for modal displacement-based weighting is introduced to avoid potential selection of sensor locations with low vibration energy, which can be critical in noisy environments. The efficiency of the proposed method is verified with numerical models of different types of structures and finally with the laboratory scale experiments. The mean error of the reconstructed response in this particular experimental case study was 1.4% of the maximum measured response amplitude. This method is especially applicable to large finite element models of industrial-scale structures with fine meshes.</p>
Show moreOrganizations and authors
Publication type
Publication format
Article
Parent publication type
Journal
Article type
Original article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A1 Journal article (refereed), original researchPublication channel information
Volume
184
Article number
109581
ISSN
Publication forum
Publication forum level
3
Open access
Open access in the publisher’s service
Yes
Open access of publication channel
Partially open publication channel
License of the publisher’s version
CC BY
Self-archived
No
Other information
Fields of science
Computer and information sciences; Electronic, automation and communications engineering, electronics; Mechanical engineering
Keywords
[object Object],[object Object],[object Object]
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1016/j.ymssp.2022.109581
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes