Crystal plasticity model for creep and relaxation deformation of OFP copper
Year of publication
2023
Authors
Andersson, Tom; Lindroos, Matti; Pohja, Rami; Biswas, Abhishek; Nandy, Supriya; Pakarinen, Janne; Rantala, Juhani
Abstract
We demonstrate a dislocation density-based crystal plasticity (CP) model approach for simulating mesoscale deformation and damage. The existing CP framework is extended to be compatible with the oxygen-free phosphorous copper microstructure that is the focus of this study. The key aim is to introduce relevant plastic deformation mechanisms and to develop a failure model capable of depicting creep damage in the material. The effect of local variations in material is evaluated, and the model response is compared with experiments and characterisation. The basis of this work is CP material modelling, including grain orientation and size, obtained using electron backscatter diffraction and experimental test data of real relaxation test specimens. This will yield a realistic description of texture and grain shape and, ultimately, accurate stress–strain response at the microstructural level for further evaluation of performance with respect to material creep(−fatigue) damage.
Show moreOrganizations and authors
VTT Technical Research Centre of Finland Ltd
Pohja Rami
Publication type
Publication format
Article
Parent publication type
Journal
Article type
Original article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A1 Journal article (refereed), original researchPublication channel information
Journal
Publisher
Volume
41
Issue
1
Pages
51-60
ISSN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
Yes
Open access of publication channel
Partially open publication channel
Self-archived
Yes
Article processing fee (EUR)
3385
Other information
Fields of science
Mechanical engineering; Materials engineering
Keywords
[object Object],[object Object],[object Object]
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1080/09603409.2023.2278232
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes