Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements

Year of publication

2024

Authors

Immonen, Antti; Goel, Priyanka; Koskinen, Tomi; Pekkanen, Matias; Tittonen, Ilkka; Kärkkäinen, Tommi; Silventoinen, Pertti; Kuisma, Mikko

Abstract

Augmented measurements of temperature distributions and the movement of heat are possible with multichannel, bendable temperature sensor films. In this paper, a method for manufacturing a laterally configured thermoelectric thermal distribution sensor structure based on printed circuit technology is presented. The proposed device incorporates an array of in-plane single-pair thermocouples into a flexible substrate. The design and prototype manufacturing process of the sensor are detailed. The results of preliminary characterization tests show that the developed sensor can be used to roughly map changes in in-plane thermal fields.

Organizations and authors

LUT University

Pekkanen Matias

Immonen Antti

Kuisma Mikko

Silventoinen Pertti

Kärkkäinen Tommi

Aalto University

Tittonen Ilkka

Goel Priyanka

Koskinen Tomi

Publication type

Publication format

Article

Parent publication type

Conference

Article type

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A4 Article in conference proceedings

Publication channel information

Publication forum level

Open access

Open access in the publisher’s service

Self-archived

Yes

Other information

Fields of science

Electronic, automation and communications engineering, electronics; Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

DOI

10.1109/I2MTC60896.2024.10561216

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes