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XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

Year of publication

2017

Authors

Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.

Organizations and authors

Aalto University

Ross Glenn Orcid -palvelun logo

Paulasto-Kröckel Mervi Orcid -palvelun logo

Vuorinen Vesa Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal

Microelectronics Reliability

Publisher

Elsevier

Volume

76-77

Pages

390-394

ISSN

0026-2714

​Publication forum

63338

​Publication forum level

1

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Fields of science

Electronic, automation and communications engineering, electronics; Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Yes

Co-publication with a company

No

DOI

10.1016/j.microrel.2017.07.044

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes