The effect of platinum contact metallization on Cu/Sn bonding
Year of publication
2018
Authors
Rautiainen, Antti; Ross, Glenn; Vuorinen, Vesa; Dong, Hongqun; Paulasto-Kröckel, Mervi
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Journal
Article type
Original article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A1 Journal article (refereed), original researchPublication channel information
Publisher
ISSN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
No
Self-archived
Yes
Other information
Fields of science
Physical sciences; Electronic, automation and communications engineering, electronics; Materials engineering
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1007/s10854-018-9663-2
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes