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Understanding Electromigration in Cu-CNT Composite Interconnects A Multiscale Electrothermal Simulation Study

Year of publication

2018

Authors

Lee, Jaehyun; Berrada, Salim; Adamu-Lema, Fikru; Nagy, Nicole; Georgiev, Vihar P.; Sadi, Toufik; Liang, Jie; Ramos, Raphael; Carrillo-Nunez, Hamilton; Kalita, Dipankar; Lilienthal, Katharina; Wislicenus, Marcus; Pandey, Reeturaj; Chen, Bingan; Teo, Kenneth B.K.; Goncalves, Goncalo; Okuno, Hanako; Uhlig, Benjamin; Todri-Sanial, Aida; Dijon, Jean
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Organizations and authors

Aalto University

Sadi Toufik Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

IEEE Transactions on Electron Devices

Publisher

IEEE

Volume

65

Issue

9

Pages

3884-3892

ISSN

0018-9383

​Publication forum

57538

​Publication forum level

2

Open access

Open access in the publisher’s service

No

Self-archived

Yes

Other information

Fields of science

Physical sciences

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Yes

Co-publication with a company

Yes

DOI

10.1109/TED.2018.2853550

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes