Upside down T-shape through-wafer interconnects for fully tileable photodiode matrix for medical CT imaging

Year of publication

2012

Authors

Juntunen, Mikko; Ji, Fan; Hietanen, Iiro; Eränen, Simo

Organizations and authors

VTT Technical Research Centre of Finland Ltd

Eränen Simo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Sensors and Actuators A: Physical

Volume

184

Pages

41-45

ISSN

0924-4247

Publication forum

67021

Publication forum level

Open access

Open access in the publisher’s service

Self-archived

Other information

Fields of science

Electronic, automation and communications engineering, electronics

Keywords

[object Object],[object Object],[object Object],[object Object]

Language

English

International co-publication

Co-publication with a company

Yes

DOI

10.1016/j.sna.2012.06.025

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes