Tantalum carbide and nitride diffusion barriers for Cu metallisation

Year of publication

2002

Authors

Laurila, T.; Zeng, K.; Kivilahti, J. K.; Molarius, J.; Riekkinen, T.; Suni, I.

Organizations and authors

Aalto University

Kivilahti J. K.

Zeng K.

Laurila Tomi

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Microelectronic Engineering

Publisher

Elsevier

Volume

Issue

1-2

Pages

71-80

ISSN

0167-9317

Publication forum

63335

Publication forum level

Open access

Open access in the publisher’s service

Self-archived

Other information

Keywords

[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

DOI

10.1016/S0167-9317(01)00582-2

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes