Interfacial Phase Formation in Sn-Ag-Cu Solder Joints with Ni/Au Coated Boards

Year of publication

2002

Authors

Zeng, Kejun; Vuorinen, Vesa; Kivilahti, Jorma K.

Organizations and authors

Aalto University

Vuorinen Vesa

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

IEEE Transactions on Components, Packaging and Manufacturing Technology

Publisher

IEEE

Volume

Pages

162-167

Open access

Open access in the publisher’s service

Self-archived

Other information

Keywords

[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes