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Void formation and its impact on Cu-Sn intermetallic compound formation

Year of publication

2016

Authors

Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi

Organizations and authors

Aalto University

Ross Glenn Orcid -palvelun logo

Paulasto-Kröckel Mervi Orcid -palvelun logo

Vuorinen Vesa Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal

Journal of Alloys and Compounds

Publisher

Elsevier

Volume

677

Pages

127-138

ISSN

0925-8388

​Publication forum

59526

​Publication forum level

1

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Fields of science

Electronic, automation and communications engineering, electronics; Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

DOI

10.1016/j.jallcom.2016.03.193

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes