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Interconnections based on Bi-coated SnAg solder balls

Year of publication

2002

Authors

Korhonen, Tia-Marje; Vuorinen, Vesa; Kivilahti, Jorma K.

Organizations and authors

Aalto University

Vuorinen Vesa Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

IEEE Transactions on Advanced Packaging

Publisher

IEEE

Volume

24

Issue

4

Pages

151-520

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Keywords

[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes