Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishes

Year of publication

2006

Authors

Vuorinen, V.; Laurila, T.; Yu, H.; Kivilahti, J. K.

Organizations and authors

Aalto University

Yu H.

Kivilahti J. K.

Laurila Tomi

Vuorinen Vesa

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Journal of Applied Physics

Publisher

American Institute of Physics

Volume

Issue

Article number

023530

ISSN

0021-8979

Publication forum

59616

Publication forum level

Open access

Open access in the publisher’s service

Self-archived

Other information

Keywords

[object Object]

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

DOI

10.1063/1.2166647

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes