Board-level Reliability of Lead-Free Solder Interconnections under Mechanical Shock and Vibration Loads
Year of publication
2011
Authors
Mattila, Toni Tuomas; Marjamäki, Pekka; Kivilahti, Jorma
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Compilation
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A3 Book section, Chapters in research booksPublication channel information
Parent publication name
Publisher
Wiley
Pages
371-414
ISBN
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Keywords
[object Object],[object Object],[object Object],[object Object]
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1002/9780470950012.ch17
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes