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A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

Year of publication

1998

Authors

Reinikainen, T.; Poech, M.; Krumm, M.; Kivilahti, J.K.

Organizations and authors

Aalto University

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

JOURNAL OF ELECTRONIC PACKAGING

Publisher

American Society of Mechanical Engineers

Volume

120

Issue

1

Pages

106-113

ISSN

Publication forum

Publication forum level

1

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Keywords

[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes