Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Year of publication
2013
Authors
Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Journal/Series
Parent publication name
Europe Microelectronics Packaging Conference, Grenoble, France, 10-12.09.2013
ISSN
ISBN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes