Solder/Substrate Interfacial Reactions in Sn-Cu-Ni Interconnection System

Year of publication

2007

Authors

Yu, Hao; Vuorinen, Vesa; Kivilahti, Jorma

Organizations and authors

Aalto University

Vuorinen Vesa

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Journal of Electronic Materials

Publisher

SPRINGER

Volume

Issue

Pages

136-146

Open access

Open access in the publisher’s service

Self-archived

Other information

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes