Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS
Year of publication
2014
Authors
Xu, Hongbo; Rautiainen, Antti; Vuorinen, Vesa; Österlund, Elmeri; Suni, Tommi; Heikkinen, Hannele; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Parent publication name
5th Electronics System-Integration Technology Conference (ESTC), Helsinki, Finland, 16 18, 2014
Publisher
ISBN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1109/ESTC.2014.6962771
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes