Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging
Year of publication
2014
Authors
Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ProfessionalMINEDU's publication type classification code
D3 Article in professional conference proceedingsPublication channel information
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Internationality of the publisher
International
Language
English
International co-publication
Yes
Co-publication with a company
No
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes