Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology
Year of publication
2004
Authors
McNally, P.J; Kanatharana, J.; Toh, B.H.W; McNeill, D.W; Danilewsky, A.N; Tuomi, T.; Knuuttila, L.; Riikonen, J.; Toivonen, Juha; Simon, R.
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Journal
Article type
Original article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A1 Journal article (refereed), original researchPublication channel information
Journal
Journal of Applied Physics
Publisher
American Institute of Physics
Volume
96
Issue
12
Pages
7596-7602
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Keywords
[object Object],[object Object],[object Object],[object Object]
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes