undefined

< Back to search results

Reactively sputtered Ta2N and TaN diffusion barriers for copper metallization

Year of publication

2000

Authors

Molarius, Jyrki; Laurila, Tomi; Riekkinen, Tommi; Zeng, Kejun; Niskanen, Antti; Leskelä, Markku; Suni, Ilkka; Kivilahti, Jorma K.

Organizations and authors

Aalto University

Laurila Tomi Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Conference

Article type

Other article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A4 Article in conference proceedings

Publication channel information

Parent publication name

Advanced Metallization Conference (AMC)

Conference

Advanced Metallization Conference

Pages

355-359

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes