Design for reliability of Au-Sn and Cu-Sn based SLID bonds
Year of publication
2016
Authors
Vuorinen, Vesa; Rautiainen, Antti; Paulasto-Kröckel, Mervi
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Parent publication name
20th European Microelectronics and Packaging Conference and Exhibition
Conference
European Microelectronics and Packaging Conference
Publisher
IEEE
Article number
7390735
ISBN
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Fields of science
Electronic, automation and communications engineering, electronics
Internationality of the publisher
International
Language
English
International co-publication
No
Co-publication with a company
No
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes