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Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging

Year of publication

2008

Authors

Ji, Fan; Leppävuori, Seppo; Luusua, Ismo; Henttinen, Kimmo; Eränen, Simo; Hietanen, Iiro; Juntunen, Mikko

Organizations and authors

VTT Technical Research Centre of Finland Ltd

Luusua Ismo

Henttinen Kimmo

Eränen Simo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Sensors and Actuators A: Physical

Volume

142

Issue

1

Pages

405-412

ISSN

0924-4247

​Publication forum

67021

​Publication forum level

2

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Fields of science

Electronic, automation and communications engineering, electronics

Keywords

[object Object],[object Object],[object Object],[object Object]

Language

English

International co-publication

No

Co-publication with a company

Yes

DOI

10.1016/j.sna.2007.02.030

The publication is included in the Ministry of Education and Culture’s Publication data collection

No