Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS Mirror
Year of publication
2019
Authors
Ailas, Henri; Saarilahti, Jaakko; Pensala, Tuomas; Kiihamäki, Jyrki
Organizations and authors
VTT Technical Research Centre of Finland Ltd
Ailas Henri
Saarilahti Jaakko
Kiihamäki Jyrki 
Pensala Tuomas
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Parent publication name
2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019
Conference
Article number
8760353
Pages
12-16
ISBN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Fields of science
Electronic, automation and communications engineering, electronics
Keywords
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.23919/NORDPAC.2019.8760353
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes