Health monitoring of stress-laminated timber bridges assisted by a hygro-thermal model for wood material
Year of publication
2021
Authors
Fortino, Stefania; Hradil, Petr; Koski, Keijo; Korkealaakso, Antti; Fülöp, Ludovic; Burkart, Hauke; Tirkkonen, Timo
Abstract
Timber bridges are economical, easy to construct, use renewable material and can have a long service life, especially in Nordic climates. Nevertheless, durability of timber bridges has been a concern of designers and structural engineers because most of their load‐carrying members are exposed to the external climate. In combination with certain temperatures, the moisture content (MC) accumulated in wood for long periods may cause conditions suitable for timber biodegradation. In addition, moisture induced cracks and deformations are often found in timber decks. This study shows how the long term monitoring of stress‐laminated timber decks can be assisted by a recent multi‐phase finite element model predicting the distribution of MC, relative humidity (RH) and temperature (T) in wood. The hygro‐thermal monitoring data are collected from an earlier study of the Sørliveien Bridge in Norway and from a research on the new Tapiola Bridge in Finland. In both cases, the monitoring uses integrated humidity‐temperature sensors which provide the RH and T in given locations of the deck. The numerical results show a good agreement with the measurements and allow analysing the MCs at the bottom of the decks that could be responsible of cracks and cupping deformations.
Show moreOrganizations and authors
Publication type
Publication format
Article
Parent publication type
Journal
Article type
Original article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A1 Journal article (refereed), original researchPublication channel information
Journal/Series
Volume
11
Issue
1
Article number
98
Pages
1-21
ISSN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
Yes
Open access of publication channel
Fully open publication channel
License of the publisher’s version
CC BY
Self-archived
No
Article processing fee (EUR)
1523
Year of payment for the open publication fee
2021
Other information
Fields of science
Computer and information sciences; Electronic, automation and communications engineering, electronics; Materials engineering
Keywords
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Language
English
International co-publication
Yes
Co-publication with a company
No
DOI
10.3390/app11010098
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes