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Health monitoring of stress-laminated timber bridges assisted by a hygro-thermal model for wood material

Year of publication

2021

Authors

Fortino, Stefania; Hradil, Petr; Koski, Keijo; Korkealaakso, Antti; Fülöp, Ludovic; Burkart, Hauke; Tirkkonen, Timo

Abstract

Timber bridges are economical, easy to construct, use renewable material and can have a long service life, especially in Nordic climates. Nevertheless, durability of timber bridges has been a concern of designers and structural engineers because most of their load‐carrying members are exposed to the external climate. In combination with certain temperatures, the moisture content (MC) accumulated in wood for long periods may cause conditions suitable for timber biodegradation. In addition, moisture induced cracks and deformations are often found in timber decks. This study shows how the long term monitoring of stress‐laminated timber decks can be assisted by a recent multi‐phase finite element model predicting the distribution of MC, relative humidity (RH) and temperature (T) in wood. The hygro‐thermal monitoring data are collected from an earlier study of the Sørliveien Bridge in Norway and from a research on the new Tapiola Bridge in Finland. In both cases, the monitoring uses integrated humidity‐temperature sensors which provide the RH and T in given locations of the deck. The numerical results show a good agreement with the measurements and allow analysing the MCs at the bottom of the decks that could be responsible of cracks and cupping deformations.
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Organizations and authors

VTT Technical Research Centre of Finland Ltd

Korkealaakso Antti

Koski Keijo

Fülöp Ludovic Orcid -palvelun logo

Hradil Petr Orcid -palvelun logo

Fortino Stefania

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

Applied Sciences

Volume

11

Issue

1

Article number

98

Pages

1-21

​Publication forum

82219

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Fully open publication channel

License of the publisher’s version

CC BY

Self-archived

No

Article processing fee (EUR)

1523

Year of payment for the open publication fee

2021

Other information

Fields of science

Computer and information sciences; Electronic, automation and communications engineering, electronics; Materials engineering

Keywords

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Language

English

International co-publication

Yes

Co-publication with a company

No

DOI

10.3390/app11010098

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes