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Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Year of publication

2016

Authors

Manier, Charles-Alix; Zoschke, Kai; Wilke, Martin; Oppermann, Hermann; Ruffieux, David; Dalla Piazza, Silvio; Suni, Tommi; Dekker, James; Allegato, Giorgio; Lang, Klaus-Dieter

Organizations and authors

VTT Technical Research Centre of Finland Ltd

Dekker James

Suni Tommi

Publication type

Publication format

Article

Parent publication type

Conference

Article type

Other article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A4 Article in conference proceedings

Publication channel information

Parent publication name

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2016 Symposium on

Conference

18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016

Publisher

IEEE Institute of Electrical and Electronic Engineers

Pages

1-6

ISBN

978-1-5090-1391-3

​Publication forum

5475

​Publication forum level

1

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Fields of science

Electronic, automation and communications engineering, electronics

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Language

English

International co-publication

Yes

Co-publication with a company

Yes

DOI

10.1109/DTIP.2016.7514832

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes