Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Year of publication
2013
Authors
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, James; Heikkinen, Hannele; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Journal/Series
Parent publication name
IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Volume
63
Pages
1500-1507
ISSN
ISBN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Fields of science
Electronic, automation and communications engineering, electronics
Language
English
International co-publication
Yes
Co-publication with a company
Yes
DOI
10.1109/ECTC.2013.6575770
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes