Hybrid in-mould integration
Year of publication
2013
Authors
Alajoki, Teemu; Koponen, Matti; Huttunen, Arttu; Tuomikoski, Markus; Heikkinen, Mikko; Keränen, Antti; Keränen, Kimmo; Mäkinen, Jukka-Tapani; Jaakola, Tuomo; Aikio, Janne; Rönkä, Kari
Organizations and authors
VTT Technical Research Centre of Finland Ltd
Huttunen Arttu
Aikio Janne
Mäkinen Jukka-Tapani
Rönkä Kari
Keränen Kimmo 
Tuomikoski Markus
Alajoki Teemu
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Parent publication name
46th International Symposium on Microelectronics, IMAPS 2013
Conference
46th International Symposium on Microelectronics, IMAPS 2013
Publisher
Curran Associates Inc.
Pages
188-193
ISBN
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Fields of science
Electronic, automation and communications engineering, electronics
Keywords
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Language
English
International co-publication
No
Co-publication with a company
No
The publication is included in the Ministry of Education and Culture’s Publication data collection
Yes