A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level
Year of publication
2009
Authors
Baumgartner, Tobias; Töpper, Michael; Klein, Matthias; Schmid, Bernhard; Knödler, Dieter; Kuisma, Heikki; Nurmi, Sami; Kattelus, Hannu; Dekker, James; Schachler, Ralph
Organizations and authors
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Non Peer-ReviewedMINEDU's publication type classification code
B3 Article in conference proceedings (non-peer-reviewed)Publication channel information
Parent publication name
Proceedings of the European Microelectronics and Packaging Conference & Exhibition
Conference
European Microelectronics and Packaging Conference & Exhibition, EMPC 2009
Publisher
IMAPS-International Microelectronics and Packaging Society
Open access
Open access in the publisher’s service
No
Self-archived
Yes
Other information
Fields of science
Electronic, automation and communications engineering, electronics
Keywords
[object Object],[object Object],[object Object]
Language
English
International co-publication
Yes
Co-publication with a company
Yes
The publication is included in the Ministry of Education and Culture’s Publication data collection
No