Through-wafer polysilicon interconnect fabrication with in-situ boron doping
Year of publication
2005
Authors
Luusua, Ismo; Henttinen, Kimmo; Pekko, Panu; Vehmas, Tapani; Luoto, Hannu
Organizations and authors
VTT Technical Research Centre of Finland Ltd
Luoto Hannu
Luusua Ismo
Henttinen Kimmo
Pekko Panu
Vehmas Tapani
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Journal/Series
Parent publication name
Symposium J - Micro- and Nanosystems - Materials and Devices
Publisher
Volume
872
Article number
J5.5
Pages
77-81
ISSN
Publication forum
Publication forum level
1
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Keywords
[object Object],[object Object],[object Object],[object Object]
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1557/PROC-872-J5.5
The publication is included in the Ministry of Education and Culture’s Publication data collection
No