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SOI wafers with buried cavities

Year of publication

2005

Authors

Suni, Tommi; Henttinen, Kimmo; Dekker, James; Luoto, Hannu; Kulawski, Martin; Mäkinen, J.; Mutikainen, R.

Organizations and authors

VTT Technical Research Centre of Finland Ltd

Luoto Hannu

Dekker James

Henttinen Kimmo

Kulawski Martin

Suni Tommi

Publication type

Publication format

Article

Parent publication type

Conference

Article type

Other article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A4 Article in conference proceedings

Publication channel information

Journal

ECS Proceedings Volumes

Parent publication name

Semiconductor Wafer Bonding VIII: Science, Technology and Applications: Proceedings of the International Symposium

Conference

8th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications

Publisher

Electrochemical Society ECS

Volume

2005-02

Pages

216-225

ISBN

1-56677-460-8

Open access

Open access in the publisher’s service

No

Self-archived

No

Other information

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Language

English

International co-publication

No

Co-publication with a company

Yes

The publication is included in the Ministry of Education and Culture’s Publication data collection

No