Wafer scale packaging of MEMS by using plasma activated wafer bonding
Year of publication
2005
Authors
Suni, Tommi; Henttinen, Kimmo; Lipsanen, Antti; Dekker, James; Luoto, Hannu; Kulawski, Martin
Organizations and authors
VTT Technical Research Centre of Finland Ltd
Lipsanen Antti
Luoto Hannu
Dekker James
Henttinen Kimmo
Kulawski Martin
Suni Tommi
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Journal/Series
ECS Proceedings Volumes
Parent publication name
Conference
8th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications
Publisher
Electrochemical Society ECS
Volume
2005-02
Pages
173-183
ISBN
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Keywords
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Language
English
International co-publication
No
Co-publication with a company
Yes
The publication is included in the Ministry of Education and Culture’s Publication data collection
No