Cost-effective packaging of laser modules using LTCC substrates
Year of publication
2004
Authors
Keränen, Kimmo; Mäkinen, Jukka-Tapani; Heilala, Juhani; Väätäinen, Otso; Kautio, Kari; Ollila, Jyrki; Petäjä, Jarno; Karppinen, Mikko; Heikkinen, Veli; Karioja, Pentti
Organizations and authors
VTT Technical Research Centre of Finland Ltd
Petäjä Jarno
Heilala Juhani 
Mäkinen Jukka-Tapani
Ollila Jyrki
Kautio Kari
Keränen Kimmo
Karppinen Mikko
Väätäinen Otso
Karioja Pentti
Heikkinen Veli
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Peer-ReviewedMINEDU's publication type classification code
A4 Article in conference proceedingsPublication channel information
Journal/Series
Proceedings of SPIE
Parent publication name
Conference
Integrated Optoelectronic Devices 2004
Publisher
International Society for Optics and Photonics SPIE
Pages
111-121
Open access
Open access in the publisher’s service
No
Self-archived
No
Other information
Fields of science
Electronic, automation and communications engineering, electronics
Keywords
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Language
English
International co-publication
No
Co-publication with a company
No
DOI
10.1117/12.528280
The publication is included in the Ministry of Education and Culture’s Publication data collection
No