Electroplated solder bumps for flip chip
Year of publication
1996
Authors
Kaitila, Jyrki; Majander, Päivi; Salonen, Jaakko; Suni, Ilkka
Organizations and authors
VTT Technical Research Centre of Finland Ltd
Salonen Jaakko
Publication type
Publication format
Article
Parent publication type
Conference
Article type
Other article
Audience
ScientificPeer-reviewed
Non Peer-ReviewedMINEDU's publication type classification code
B3 Article in conference proceedings (non-peer-reviewed)Publication channel information
Parent publication name
Conference
33rd ISHM-Nordic conference
Publisher
International Society for Hybrid Microelectronics
Pages
98-103
Open access
Open access in the publisher’s service
No information
Self-archived
No
Other information
Identified topic
[object Object]
Language
English
International co-publication
No
Co-publication with a company
No
The publication is included in the Ministry of Education and Culture’s Publication data collection
No