Molecular electronic refrigeration against parallel phonon heat leakage channels

Molecular electronic refrigeration against parallel phonon heat leakage channels

Year of publication

2022

Authors

Tabatabaei, Fatemeh; Merabia, Samy; Gotsmann, Bernd; Prunnila, Mika; Niehaus, Thomas A.

Abstract

<p>Due to their structured density of states, molecular junctions provide rich resources to filter and control the flow of electrons and phonons. Here we compute the out of equilibrium current-voltage characteristics and dissipated heat of some recently synthesized oligophenylenes (OPE3) using the Density Functional based Tight-Binding (DFTB) method within Non-Equilibrium Green's Function Theory (NEGF). We analyze the Peltier cooling power for these molecular junctions as function of a bias voltage and investigate the parameters that lead to optimal cooling performance. In order to quantify the attainable temperature reduction, an electro-thermal circuit model is presented, in which the key electronic and thermal transport parameters enter. Overall, our results demonstrate that the studied OPE3 devices are compatible with temperature reductions of several K. Based on the results, some strategies to enable high performance devices for cooling applications are briefly discussed.</p>
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Organizations and authors

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Volume

14

Issue

30

Article number

11003

​Publication forum

63714

​Publication forum level

2

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

License of the publisher’s version

CC BY NC

Self-archived

No

Other information

Fields of science

Materials engineering

Language

English

International co-publication

Yes

Co-publication with a company

Yes

DOI

10.1039/d2nr00529h

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes