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Penetration of corrosive species into copper exposed to simulated O<sub>2</sub>-free groundwater by time-of-flight secondary ion mass spectrometry (ToF-SIMS)

Year of publication

2023

Authors

Yue, Xiaoqi; Malmberg, Per; Isotahdon, Elisa; Ratia-Hanby, Vilma; Huttunen-Saarivirta, Elina; Leygraf, Christofer; Pan, Jinshan

Abstract

ToF-SIMS analysis of copper samples after exposures to simulated groundwater with and without sulfide addition was performed to investigate the penetration of corrosive species containing H, S, O, and Cl, into copper. Depth profiles show extent of penetration and 2D/3D images reveal local elemental distribution of the corrosive species at different depths inside copper. Pre-oxidation did not reduce the penetration while sulfide additional in groundwater and exposure at 60 °C significantly promoted the penetration. The extent of penetration of the corrosive species into copper demonstrates the need for risk assessment of complex corrosion forms such as sulfide-induced embrittlement and cracking.
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Organizations and authors

VTT Technical Research Centre of Finland Ltd

Huttunen-Saarivirta Elina

Isotahdon Elisa Orcid -palvelun logo

Ratia-Hanby Vilma Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Volume

210

Issue

Part 2

Article number

110833

​Publication forum

54152

​Publication forum level

3

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

License of the publisher’s version

CC BY

Self-archived

No

Other information

Fields of science

Mechanical engineering; Materials engineering

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object]

Language

English

International co-publication

Yes

Co-publication with a company

No

DOI

10.1016/j.corsci.2022.110833

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes