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Machine Vision System Utilizing Black Silicon CMOS Camera for Through-Silicon Alignment

Year of publication

2022

Authors

Vlasov, Aleksandr A.; Aydin, Alp E.; Uusitalo, Topi; Viheriala, Jukka; Guina, Mircea

Organizations and authors

Tampere University

Vlasov Aleksandr A.

Viheriala Jukka

Guina Mircea Orcid -palvelun logo

Uusitalo Topi Orcid -palvelun logo

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volume

12

Issue

12

Pages

2019-2026

ISSN

2156-3950

​Publication forum

70578

​Publication forum level

1

Open access

Open access in the publisher’s service

Yes

Open access of publication channel

Partially open publication channel

Self-archived

Yes

Other information

Fields of science

Physical sciences

Identified topic

[object Object]

Internationality of the publisher

International

Language

English

International co-publication

No

Co-publication with a company

No

DOI

10.1109/TCPMT.2022.3225051

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes