Reliability study on adhesive interconnections in flex-to-flex printed electronics applications under environmental stesses

Year of publication

2014

Authors

Happonen, Tuomas; Voutilainen, Juha-Veikko; Fabritius, Tapio

Organizations and authors

University of Oulu

Voutilainen Juha-Veikko Ilari

Happonen Juho Tuomas

Fabritius Tapio

Publication type

Publication format

Article

Parent publication type

Journal

Article type

Original article

Audience

Scientific

Peer-reviewed

Peer-Reviewed

MINEDU's publication type classification code

A1 Journal article (refereed), original research

Publication channel information

Journal/Series

IEEE transactions on device and materials reliability

Issue

Pages

1005-1012

ISSN

1530-4388

Publication forum

57534

Publication forum level

Open access

Open access in the publisher’s service

Self-archived

Other information

Fields of science

Electronic, automation and communications engineering, electronics

Keywords

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Publication country

United States

Internationality of the publisher

International

Language

English

International co-publication

Co-publication with a company

Unknown

DOI

10.1109/TDMR.2014.2356477

The publication is included in the Ministry of Education and Culture’s Publication data collection

Yes